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Engineering Precision: Advancing the Reliability of BGA Solder Joints in Automotive Applications
Mälardalen University, School of Innovation, Design and Engineering, Innovation and Product Realisation. Luleå University of Technology, Luleå, Sweden.ORCID iD: 0000-0002-7458-6820
2025 (English)In: IEEE Reliability Magazine, E-ISSN 2641-8819, Vol. 2, no 1, p. 27-33Article in journal (Refereed) Published
Abstract [en]

From controlling engine performance to enabling life-saving advanced driver-assistance systems (ADAS), the modern vehicle relies on a network of electronic systems that demand exceptional precision and reliability. At the heart of these systems are ball grid arrays (BGAs)—the tiny solder joints that provide the electrical and mechanical connections essential for smooth operation (see Figure 1). While they may be invisible to the casual observer, BGAs are integral to automotive technology.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2025. Vol. 2, no 1, p. 27-33
Keywords [en]
Reliability, Soldering, Testing, Materials reliability, Automotive engineering, Vibrations, Stress, Reliability engineering, Power system reliability, Thermal stability
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:mdh:diva-70112DOI: 10.1109/mrl.2024.3523859OAI: oai:DiVA.org:mdh-70112DiVA, id: diva2:1936759
Available from: 2025-02-11 Created: 2025-02-11 Last updated: 2025-10-10Bibliographically approved

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Lin, Jing

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